Canteliver Probe Card
MPI Cantilever Probe Card is commonly utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes will be the corresponding remedy to the demands of fine pitch, tiny pad measurement, significant velocity, significantly less cleaning, multi-DUT, substantial pin rely, and extremely-very low leakage prerequisites. With excellent craftsmanship, impressive architecture and tested methodologies based on mechanical and electrical simulation/measurement outcomes, creating MPI the top cantilever provider globally.
FCB Probe Card
The FCB Probe Card is among the most mature technologies of buckling beam probe card. It's aimed to attain the semiconductor ship manufacture time-to-marketplace (TTM) and cost of test (COT) demand from customers. FCB is usually a demonstrated Option for various semiconductor creation exams from early engineering pilot-runs to superior quantity manufacturing (HVM). FCB is ready for product necessitating higher signal integrity probing (SI) and/or ability integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB ensures the entire world’s best In general Value-of-ownership (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is an improvement more than the standard buckling beam probe card. Essential features are better existing carrying potential (C.C.C.) and decrease well balanced Make contact with force (BCF), and also General MEMS-like features. EVS can easily meet up with the need of Innovative wafer probing. Specific alignment and outstanding planarity Command will be the vital aspects contributing to secure contact resistance. With its capability and general performance, EVS Probe Card is a great option for Highly developed probe cards.
Osprey probe get more info card
The Osprey probe card is MPI’s Remedy to demand from customers for at any time finer pitch. It's created for scaled-down Al pad, and is ideal for small pitch application with peripheral and full array pattern. With precise alignment and greater planarity Regulate, Osprey can arrive at greater productiveness by multi-DUT layout. The forming wire (FW) form needle manufactured with MPI’s own micro fabrication method not merely delivers substantial-excellent general performance but also enables simple needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which can be made for the need of reduced force probing. Additionally, it comes with a chance to fulfill substantial C.C.C. and significant pin counts application. The MEMS method guarantees extremely consistent needle characteristics, as well as Distinctive framework design and style enables specific alignment and planarity Regulate.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/